Jointing and assembling technology at PI Ceramic
PI Ceramic has comprehensive know-how and many years of experience in the manufacture of piezoceramic components and subsystems.
Soldering processes at PI Ceramic:
Ready-made piezo components with connecting wires are manufactured by trained staff using hand-soldering processes. We have modern automatic soldering devices at our disposal to solder to miniaturized components. Soldered joints which are required to be extremely reliable undergo special visual inspections. This is done by using optical methods ranging from stereo microscopes to camera inspection systems, depending on the specific requirements.
Mounting and assembling technology at PI Ceramic:
The jointing of components, e. g. with adhesive, is carried out in batch production using automated equipment which executes the necessary jointing procedure (e. g. curing of epoxy adhesives) and hence guarantees uniform quality.
The choice of adhesive and the curing regime are optimized for each product, taking into consideration the properties of the materials being joined and the intended operational conditions. Dosing and positioning devices which have been designed in-house are used for complicated special orders.
Our own piezoceramic stack actuators (PICATM series), highvoltage bender actuators and high-power acoustic components, all of which are manufactured using jointing processes, have proved themselves repeatedly in the semiconductor industry and in medicine, thanks to their high reliability.