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Ceramic shaping processes
The basic technology for the manufactoring of piezoceramic components is the pressing of shaped bodies
using spraydried granular material. This is achieved using high-capacity
presses with up to 1 MN compacting force. The shaped bodies are either
manufactured true-to-size, taking into account the sintering contraction, or
with machining excesses which are removed to achieve the required precision.
By using high-production inboard diamond sawing equipment, it is possible to
manufacture reasonably priced components (disks, plates, etc.) with a
thickness as low as 0.2 mm. Modern ultrasonic machining techniques are used
to manufacture thin-walled tubes with wall thicknesses of 0.5 mm as standard
products.
Cofiring technology is available, in particular for the
production of multilayer components (PICMA® series). In it, after the
application of noble metal electrodes by means of special screen printing
techniques and subsequent lamination, a ceramic film of at least 25 µm -
made in a process known as tape casting - is applied and sintered in a
onestep process.
Manufacturing and assembling technology at PI Ceramic
PI Ceramic has comprehensive know-how and many years of experience in the
manufacture of piezoceramic components and subsystems.
Soldering processes at PI
Ceramic:
Ready-made piezo components with connecting wires are manufactured by trained
staff using hand-soldering processes. We have modern automatic soldering
devices at our disposal to solder to miniaturized components. Soldered
joints which are required to be extremely reliable undergo special visual
inspections. This is done by using optical methods ranging from stereo
microscopes to camera inspection systems, depending on the specific
requirements.
Mounting and assembling
technology at PI Ceramic:
The assembly of components, e. g. with adhesive, is carried out in batch
production using automated equipment which executes the necessary
procedures (e. g. curing of epoxy adhesives) and hence guarantees uniform
quality.
The choice of adhesive and the curing regime are optimized for each product,
taking into consideration the properties of the materials being joined and
the intended operational conditions. Dosing and positioning devices which
have been designed in-house are used for complicated special orders.
PIC piezoceramic stack actuators (PICA™ series), bender actuators and high-power acoustic components, have proved themselves repeatedly in the semiconductor and medical industry, thanks to their extreme reliability.
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